Layerohm

Impedance, loss, thermal vias

Purpose-Built

PCB stackup and transmission-line lab for microstrip, stripline, grounded coplanar waveguide, differential pairs, propagation delay, conductor/dielectric loss, and thermal vias.

Core Features

Microstrip impedance sweep
Differential, delay and loss cues
Editable stack records
Local coupon-photo evidence

Private by Design

No account, subscription, ads, tracking, third-party analytics, or developer-operated backend. Core features work offline, and your work stays on device unless you deliberately share or export it.

Use It Responsibly

Impedance estimates are pre-layout aids. Confirm the final stackup, material properties, copper geometry, fabrication tolerances, field-solver results, and manufacturer guidance.